I'm designing a very simple board that has the above-mentioned component and an interface for the host MCU via I2C.
As a double check, I was wondering if there are any tips or problems that I should take into consideration for this layout.
I think I can also share privately the layout with one of the Bosch team members if he/she is willing to review it.
Any tip is accepted, many thanks!
You could refer BHI260AP shuttle board schematic, and refer HSMI document for layout.
BHI260AP shuttle board 3.0: https://www.bosch-sensortec.com/media/boschsensortec/downloads/shuttle_board_flyer/application_board...
HSMI document: https://www.bosch-sensortec.com/media/boschsensortec/downloads/handling_soldering_mounting_instructi...