we are planning to use the BME280 as environmental sensor.
After studying the datasheet (BST-BME280-DS002-15 , Rev. 1.6) and the "Handling, soldering and mounting instruction" (BST-BME280-DS006-00 , Rev. 1.8), I am concerned as for several reasons we would need to manufacture the electronic board by using vapor phase process.
In the datasheet's chapter 7.11 and the soldering instruction's chapter 3.4 it is clearly stated, that vapor phase soldering has to be avoided.
Is there a packaging version (eventually with a protective cap), that allows vapor phase soldering or do you have any recommendations, which can help us going forward?
Solved! Go to Solution.
Unfortunately we do not offer any "protected" packaging of our sensors.
The only recommendation we could make based on the HSMI manual, would be for you to evaluate covering the hole of the device with a protective cover during your process, for example with Kapton tape.