I have two different assemblies, one with the 680 and one with the 280 sensor. I am looking to recondition both sensors at the same time with the same set up. I am planning to recondition at the following:
- dry baking at 125C and <5% rH for 6 hours
- re-hydration at 70C and 75% rH for 6 hours
This is a combination of the suggested rehrydation procedures for both products. My questions:
- is there any risk to the BME680 chip for rehydration at the higher temperature and shorter duration?
- is there any risk to the BME280 chip due to dry baking at a slightly higher temp for the extended duration?
There were BME280 and BME680 handing, solering and mounting instructions document, you could refer to the requirements and operations in the document.