What is the alignment accuracy between the die inside the physical package and the physical package itself?
Said differently, what is the maximum misalignment between XYZ axes reported by the BMI160 and the physical IC package it's housed in?
I'm asking because we are seeing significant misalignment errors, on the order of 2+ degrees (!!!). Meanwhile, theST LSM6DS3 is aligned within 0.1 degrees to its physical package. I can't find a specification for this in the BMI160 spec sheet.
Solved! Go to Solution.
As of today (April 24th 2018), this is specified on page 9 of the datasheet.Typical value is within +-0.5 degrees between sensig element and plastic package, but overall alignment error can be affected by many factors.
I have many follow-up questions:
How are you testing this parameter? How many parts have you tested? How do you confirm the ground truth? Does your measurement include soldering misalignment? Is the offset bias always in the positive direction on all board?