We need to know you solder it it by hand or machine.We suggest you use SMT machine,here is follow Handling instruction in datasheet:
This device has built-in protections against high electrostatic discharges or electric fields (e.g.
2kV HBM); however, anti-static precautions should be taken as for any other CMOS component.
Unless otherwise specified, proper operation can only occur when all terminal voltages are kept
within the supply voltage range. Unused inputs must always be tied to a defined logic voltage
We recommend careful handling of the WLCSP to avoid chipping from the bare silicon.
Note: It is strongly recommended to mount the WLCSP device without any underfill. The
specified electrical parameters might be influenced when using underfill material.
Please read our HSMI document for more details.
What comm protocol will you be using ? SPI 3-4 wires, I2c ? Basically all the info you need is in the manual, pages 42-44.
How many layers do you plan to use on your pcb ? Just use the schematic on those pages, do the fan out first, place the necessary vias and you're good to go. I wouldn't use GND planes under or around the chip.