The datasheet of the BMP388 states that it should not be soldered using vapor phase soldering, however, this is the only technology that we are using. Furthermore, the datasheet states that the sensor "might" be damaged by vapor phase soldering.
My questions therefore are:
Should vapor phase soldering be used, what is the likelihood of damage?
Are there any workarounds to allow vapor phase soldering of that component? I've seen it mentioned for the BMP280 that the component can be covered with kapton tape, but this requires opening the strip before the component is placed