Hello,
We have problem with the solderability of the BHI260AP component.
On some of our boards (roughly 10%) the soldarability of some of the pads on the component is very poor, see attach picture. We have contacted our contract manufacturers who assemble the component on the PCB, and we have tried to adjust the process (solder paste, temperature, thickness of stencil etc), with no success. More adjustments in the process may solve the problem but right now both us and our contract manufacturer don't know which adjustments to make in order to proceed. Do you have any suggestions for the solder process that can help us with this problem?
We have also noticed that some of the pads on the component seem to have oxidized or have poor soldarability which makes it very hard for the component to get a good electrical connection to our PCB.
Is there anyone else that have the same problem?
Is there any other solder/ storage recommendations that aren't listed in the datasheet?
