Hi, I've got a BME280 which has humidity values that are off by 10% or so, which from what I read happens when the operating conditions are exceeded. In this case it seems it could only be from the reflow soldering process as the boards were turned on with a few hours of soldering. One of the 'reconditioning options' is after reflow soldering leaving the board for 5 days at >40% humidity. Is there something that would happen if the chip is powered before the 5 days has elapsed that prevents the humidity 'error' from dissapating? I guess what I'm getting at is what are the mechanics of this? Do high temperatures reset something internally and is there some kind of internal callibration/trim that is done at the first turn on after this reset? I am trying to avoid the situation where boards may end up in a cycle of being tested, getting baked and then sitting in a temperature and humidity controlled enclosure for hours. Thanks, John
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