Hello Bosch Sensortec Community,
I am currently working on a project that involves radio frequency and microwave technology. My overall goal is to enhance the design of a PCB intended for a wireless communication device operating at GHz frequencies. The project incorporates high-frequency components such as amplifiers, mixers, filters, and transmitters.
I have completed the first phase of design and development, but I am facing several challenges related to signal integrity, electromagnetic interference (EMI), and heat management. Here are the specific issues I was encountering:
1. I am noticing signal degradation at high frequencies. Despite following best practices for PCB layout, the signal quality is not as expected.
2. There is significant electromagnetic interference affecting the performance of the device. I was looking for effective shielding and grounding techniques that can help mitigate this issue.
3. The high-frequency components generate considerable heat, which is impacting the overall reliability of the PCB. We need advice on efficient thermal management solutions to dissipate this heat.
I would greatly appreciate any insights, suggestions, or resources that could help us address these challenges. If anyone has experience with similar issues or can recommend specific Bosch Sensortec sensors or components that might be suitable for our application, that would be incredibly helpful.
Thank you in advance for your assistance!