We plan to use BMP390 pressure sensors in an aerodynamics experiment. To do this, we intend to encapsulate ("pot") a (flexible) PCB holding the sensor, up to the level of the top of the lid, leaving the sensor's top surface exposed in a smooth surface.
The HSMI [BST-BMP3xy-HS000-05, Rev 1.5] (Sec 7.1.4) recommends avoiding "contact" of the encapsulant with the sensor casing, though it also uses the word "un-symmetric". If the encapsulant touches the casing, but on all sides (symmetrically), will that affect the device? We are concerned that a gap around the sensor will cause aerodynamic anomalies.
If it is useful: We have in mind to use as encapsulant 3M's "DP100 Plus", which is quite soft.
Thank you for any suggestions.