About question 1----you know pcb is multi-layer, if the pcb thickness is more thicker, the inner layer is easier to make deformation and it will generate more intrinsic stress, so that's why it's recommended that the pcb thickness should be less than 0.8mm in datasheet. About question 2---you can mount you sensors together with your other elements on one board, how to put the sensors, you can refer to the document bst-mis-hs000.pdf, section 5.1 for details. About question 3--- I think there is no necessary to cover the sensor with ceramic LCC package, maybe metal shield is enough. About question 4---we don't have the plots of bias over temperature, you can refer to the parameter TCO.
And what's the meaning of SF you mentioned?
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