About The_DudE

Hello, Just a last update on this thread: I got a new batch of my BME680 daughtercard (no vapor-phase this time), and it looks good. Thanks again for your support. Laurent ... View more

Hello, I actually had a phonecall with my PCBA and it turns-out that he used vapor-phase oven to "cook" this proto batch. As it's stated in the HSMI document  not to employ vapor-phase oven, I guess I have my culprit... Note that one (out of 20) of my BME680 apparently survived the process and is working normally. So I'll make a new batch with proper reflow and see how it goes. ... View more

Ok, I'll try the "protect-after- reflow" option in a next proto batch. Thanks for your support. Laurent ... View more

Although it could be ok for a small manually placed batch, I don't really see how putting tape on each chip will be feasible for a real assembly run as: - getting chips out of the reel for putting the protective tape (cutting it into BME sized pieces beforehand...), then you can not use pick and place machine anymore (reconditionning into reel is not an option). - Putting the tape after pick & place will certainly compromise placement. I guess that reflow part (not vapour-phase oven) should be harmless for the BME (unlike cleaning/washing), so it might  be enough to put protecting cover after reflow ? Don't you have an example of PCBA process flow that is known to work with or without protective cover ?   ... View more

Hello, I had a look to the HSMI document and it states: The vent hole of the sensor shall be covered with a silicone-free protective layer during processing (e.g. cleaning, soldering, board wash etc.) to prevent possible contamination How is this supposed to be done by the PCBA? If this is a real requirement, shouldn't the BME come with a removable protective cover (like some others Hydro or Baro chips) ? ... View more