It's interesting that the register map dump is showing "skipped measurements". I'll look into this and try and share more valuable information to you from this sensor. The data that I gathered for you was indeed using single-byte reads but this is not how we program our units. We use burst reads but for debugging purposes, we are using single-byte reads. From what I have noticed, all the non-working sensors are capped and giving constant 0xFF while the sensors are powered. Majority of the sensors are seeing failures from the initial start up, but a few were working as expected then went down over certain duration of time. Our units are manufactored in a mass manufactoring facility and we provided them the HSMI manual to ensure it is being followed. I would like to highlight the key points I have found and ensure I didn't miss any with you so I can start a converation with them and ensuring these instructions are being followed. Ignoring the placement details which we confirmed are being followed, the instructions are as follows: Solder must be Pb free with peak temperature of 260 C for 20-40 seconds and no more. The minimum height of the solder after reflow should be at least 50 um. Avoid excess solder paste Do not use any liquids of any kind around the sensor (flux, cleaning agents, air-pistol, etc.) unless protective actions are taken around the vent hole of the sensor Max of only three reflow cycles Reconditioning procedure is mandatory when the sensor is exposed to conditions that exceed the limits in accordance to the datasheet (e.g reflow). Dry-Bake: 120 C at <5% rH for 2 hours or N/A (reflow only) 70 C at 75% rH for 6 hours or 25 C at 75% rH for 24 hours or ~25 C at >40% rH for >5 days (reflow only) 1 hour at room temperature or N/A (reflow only) Vapor phasing soldering must be avoided Are there any main instructions that I missed? Are there any other procedures we can conduct with the working/non-working sensors as we talk to our manufactoring team to determine if something else is occuring?
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