Hi, we are looking at a prototype that will include BME688. I cant find any mech integration guidelines or CAD packing models. Is such things available?
It would also be good to have guidelines about optimal placement with regards to sensing of matters.
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you could refer BME688 data sheet and the document for handling, soldering and mounting instructions.
Thank you for this. I reviewed the HSMI document. In there it mentions a couple other documents but I can't seem to find them anywhere. Can you help?
We're interested in incorporating this into a product that we'd like to have NEMA 4X enclosure rating. It's possibly we'll have to seal around a cable and accept the sensor itself may not be sealed to this level. To get started though, I'd like to make sure I have access to all relevant application notes and support material. If you have any additional suggestions to help improve device sealing/protection it would be very helpful.