Hi, In my research i have used BMP581. i want internal mechanical structure of BMP581.The MEMS capacitive pressure sensor uses MEMS technology to produce a diaphragm grid on the silicon chip. The two upper and lower diaphragms become a group of capacitive pressure sensors. The upper MEMS capacitive pressure sensors use MEMS technology to create a grid-like shape on a silicon wafer. The two upper and lower transverse barriers become a group of capacitive pressure sensors. The upper diaphragm is displaced downward by pressure. Changed the spacing between the upper and lower two horizontal barriers. It also changes the size of the capacitance between the boards.can any one share the photo of BMP581 MEMS internal structure Capacitve pressure sensor with uppeer and lower diaphram?
