Re: Possibility of sensor damage during the vapor process
The BMP280 features an open cavity design (i.e. there is a small hole in the top lid), which has to be protected against all kinds of liquids. Therefore if you cannot protect the sensor as suggested above during your assembly process, vapor phase soldering may damage the sensor and we cannot guarantee its proper operation anymore. Would you be able to consider reflow convection ovens with your PCB manufacturer?